{"content_id":"vmz91vr9li","slug":"ai-semiconductor-substrate-glass-transition","images":[{"id":1148,"url":"https://injoys.com/rails/active_storage/blobs/proxy/eyJfcmFpbHMiOnsiZGF0YSI6MTYyMjAsInB1ciI6ImJsb2JfaWQifX0=--ab5c8e230787c7d6691f2fc19f05a3a928ed0396/ai-e18c9afe.webp","is_representative":true,"generation_method":"ai_photo","license":"ai_generated","mime_type":"image/webp","translations":{"ko":{"alt":"클린룸에서 대형 투명 반도체 기판을 검사하는 방진복 차림의 작업자","caption":"작업자가 현미경과 모니터를 이용해 유리 반도체 기판의 미세 회로와 결함을 검사하고 있다.","description":null},"en":{"alt":"Cleanroom worker inspecting a large transparent semiconductor substrate under a microscope","caption":"A technician uses a microscope and monitor to inspect the fine circuitry and defects of a glass substrate.","description":null},"ja":{"alt":"クリーンルームで大型の透明な半導体基板を顕微鏡検査する作業員","caption":"作業員が顕微鏡とモニターを使い、ガラス基板の微細回路や欠陥を検査している。","description":null},"es":{"alt":"Técnica inspeccionando un gran sustrato semiconductor transparente en una sala limpia","caption":"Una técnica usa un microscopio y un monitor para revisar los circuitos finos y defectos de un sustrato de vidrio.","description":null},"id":{"alt":"Teknisi memeriksa substrat semikonduktor transparan berukuran besar di ruang bersih","caption":"Teknisi menggunakan mikroskop dan monitor untuk memeriksa sirkuit halus serta cacat pada substrat kaca.","description":null},"pt":{"alt":"Técnica inspecionando um grande substrato semicondutor transparente em uma sala limpa","caption":"Uma técnica usa microscópio e monitor para verificar circuitos finos e defeitos em um substrato de vidro.","description":null},"zh-hant":{"alt":"無塵室技術人員以顯微鏡檢查大型透明半導體基板","caption":"技術人員透過顯微鏡與螢幕檢查玻璃基板上的精細電路和缺陷。","description":null},"de":{"alt":"Technikerin prüft in einem Reinraum ein großes transparentes Halbleitersubstrat","caption":"Eine Technikerin untersucht mit Mikroskop und Monitor die feinen Schaltungen und Defekte eines Glassubstrats.","description":null}}},{"id":1149,"url":"https://injoys.com/rails/active_storage/blobs/proxy/eyJfcmFpbHMiOnsiZGF0YSI6MTYyMzMsInB1ciI6ImJsb2JfaWQifX0=--e0815ebd110ee735efcde353ea96e8aba06e81bd/ai-50153c08.webp","is_representative":false,"generation_method":"ai_image","license":"ai_generated","mime_type":"image/webp","translations":{"ko":{"alt":"다층 유기 기판과 투명 유리기판 기반 AI 반도체 패키지 구조 비교","caption":"칩, 배선, 수직 연결부, 솔더볼로 구성된 두 반도체 기판 구조와 제조·검사 요소를 비교한다.","description":null},"en":{"alt":"Comparison of AI chip packages using a multilayer organic substrate and transparent glass substrate","caption":"The graphic compares two substrate structures with chips, wiring, vertical interconnects, solder balls, and process indicators.","description":null},"ja":{"alt":"多層有機基板と透明ガラス基板を用いたAI半導体パッケージ構造の比較","caption":"チップ、配線、垂直接続、はんだボールを備えた2種類の基板構造と製造・検査要素を比較している。","description":null},"es":{"alt":"Comparación de paquetes de chips de IA con sustrato orgánico multicapa y sustrato de vidrio","caption":"El gráfico compara dos estructuras con chips, cableado, interconexiones verticales, bolas de soldadura e indicadores de proceso.","description":null},"id":{"alt":"Perbandingan paket chip AI dengan substrat organik berlapis dan substrat kaca transparan","caption":"Grafik ini membandingkan dua struktur substrat dengan cip, jalur, koneksi vertikal, bola solder, dan indikator proses.","description":null},"pt":{"alt":"Comparação de pacotes de chips de IA com substrato orgânico multicamada e substrato de vidro","caption":"O gráfico compara duas estruturas com chips, fiação, interconexões verticais, esferas de solda e indicadores de processo.","description":null},"zh-hant":{"alt":"多層有機基板與透明玻璃基板的AI半導體封裝結構比較","caption":"圖中比較兩種基板的晶片、布線、垂直互連、焊球及製程檢測要素。","description":null},"de":{"alt":"Vergleich von KI-Chipgehäusen mit organischem Mehrlagensubstrat und transparentem Glassubstrat","caption":"Die Grafik vergleicht zwei Substrukturen mit Chips, Leiterbahnen, vertikalen Verbindungen, Lötkugeln und Prozessanzeigen.","description":null}}},{"id":1150,"url":"https://injoys.com/rails/active_storage/blobs/proxy/eyJfcmFpbHMiOnsiZGF0YSI6MTYyNDAsInB1ciI6ImJsb2JfaWQifX0=--823ae798f956cd27422899f9400564e7a8d9552a/ai-abd17a7b.webp","is_representative":false,"generation_method":"ai_infographic","license":"ai_generated","mime_type":"image/webp","visible_locales":["ko"],"translations":{"ko":{"alt":"AI 칩·HBM 패키지 적층 구조와 유리기판의 장단점, 채택 경로, 투자 검증 단계를 정리한 인포그래픽","caption":"FC-BGA와 고다층 PCB 구조부터 유리기판 전환 및 양산 검증 기준까지 설명한다.","description":null},"en":{"alt":"Infographic of an AI chip and HBM package stack, glass substrate trade-offs, adoption paths, and validation stages","caption":"The graphic explains FC-BGA and multilayer PCB structures alongside criteria for glass substrate adoption and production.","description":null},"ja":{"alt":"AIチップとHBMの積層構造、ガラス基板の長所と課題、採用経路、投資検証段階を示す図解","caption":"FC-BGAと多層PCBの構造からガラス基板への移行条件と量産検証までを解説している。","description":null},"es":{"alt":"Infografía de la pila de chip de IA y HBM, ventajas y retos del sustrato de vidrio y etapas de validación","caption":"El gráfico resume la estructura FC-BGA y PCB multicapa, junto con los criterios para adoptar sustratos de vidrio.","description":null},"id":{"alt":"Infografik susunan cip AI dan HBM, manfaat serta tantangan substrat kaca, jalur adopsi, dan tahap validasi","caption":"Grafik ini menjelaskan struktur FC-BGA dan PCB multilapis serta kriteria peralihan ke substrat kaca dan produksi massal.","description":null},"pt":{"alt":"Infográfico da pilha de chip de IA e HBM, vantagens e desafios do substrato de vidro e etapas de validação","caption":"O gráfico resume as estruturas FC-BGA e PCB multicamada e os critérios para adoção e produção de substratos de vidro.","description":null},"zh-hant":{"alt":"AI晶片與HBM封裝堆疊、玻璃基板優缺點、採用路徑及投資驗證階段資訊圖","caption":"圖表說明FC-BGA與高多層PCB結構，以及轉用玻璃基板和量產驗證的判斷標準。","description":null},"de":{"alt":"Infografik zu KI-Chip- und HBM-Stapel, Vor- und Nachteilen von Glassubstraten sowie Validierungsphasen","caption":"Die Grafik erläutert FC-BGA- und Mehrlagenleiterplatten sowie Kriterien für den Umstieg auf Glassubstrate und die Serienfertigung.","description":null}}}]}